EMC PCB Design and Integration
If you are a design or compliance engineer, it pays for you to know how and why EMI testing is conducted, as well as the typical causes of failure. This 3-day course offers all of the EMI information you’ll need to design compliant Printed Circuit Boards (PCBs)—including design considerations at CAE and CAD levels—for you to provide a compliant radiation/susceptibility product. You’ll examine ways to prevent common EMI/EMC problems regarding power supplies, cables, connectors, slots, discontinuity of ground planes and more. This three-day class will focus on EMI and RFI issues regarding PCBs, computers, analog designs and systems, along with relevant EMI regulations in the U.S., the European Union and Asia. Highlights include PCB radiation basics, radiation and bypass on PCBs, PCB radiation suppression techniques, grounding designs/filtering, crosstalk/termination, power and ground planes, antenna loops, spread spectrum clocking, and differential-mode and common-mode radiation. Enclosure and supplemental control techniques are presented as a part of design where the PCB control measures are restricted.
What you will learn:
This course will provide you with the knowledge to design a compliant EMC system right the first time. It provides a set of rules for both PCBs and enclosures to identify and correct EMI design deficiencies. It provides you with tips & techniques to successfully conduct compliance testing at the FCC, MIL-STD or EU testing facilities.
Frequency, time, and distance; lumped versus distributed systems, four kinds of reactance, ordinary and mutual capacitance and inductance.
- EMI CONCERNS
EMI, source, path and receptor; threats, EMI issues, EMI regulations.
- CONDUCTING A COMPLIANCE TEST WITH EMPHASIS ON THE PCB AND ENCLOSURE
Conducted emissions, radiated emissions, RF immunity, conducted RF immunity, ESD, lightening, electrical fast transient, shock and EMP.
- EMI DESIGN REQUIREMENTS FOR PCBs
Interference coupling mechanism, CM radiation, antenna loops, basics of PCB radiation, PCB suppression techniques, design for immunity, switching mode power supplies (SMPS)
- DESIGN CONSIDERATIONS FOR EMI COMPATIBILITY
Crosstalk – inductive/capacitive, forward/backward – how does it occur? Why does it cause radiation how is it minimized? Picket fences, Cu fills, spread spectrum clocking, bypass and radiation on PCBs, Near/Far field, differential/common coupling modes and resonance, analog circuitry.
- POWER DISTRIBUTION AND GROUNDING
Power/ground planes why do they cause radiation and how is it minimized? Splits, slots, moats, floats, drawbridge, how to design for minimizing emissions from power/ground planes. How to design for digital/analog (multibias) and single bias PCBs. Ideal stackups to be EMC.
- CABLES/CONNECTORS AND PCB, CONCERNS OF PCBs INTERFACING WITH FILTERING AND SHIELDING
Capacitive and magnetic shielding, slots in PCBs, shield grounding, cable radiation, shielding types, transfer impedance, shielding connection.
- ENCLOSURES, MOTHERBOARDS, BACKPLANES AND BLADES
Loss of PCB ground plane in cables, how to design a PCB land trace to a connector pin to eliminate reflections, cables configuration, antenna loops with cable connections, high-speed connectors.
- FILTERING AND SHIELDING
Shielding versus filtering, using ferrites, filtering mains supply, using transients suppressors on mains and I/O lines, radiation through shields.
- BACKPLANE LAYOUT CONCERNS
Effects of source and load impedance and why mismatches cause radiation, the capacitive load: Zo and propagation delay and radiation effects, 90o, 45o bends, guard traces, interplane capacitance, via discontinuity and vias resonance concerns, backdrilling vias.
- BUSSES AND DIFFERENTIALS
Multidrop systems, drivers, transceivers, and designing a high-speed bus, attributes/drawbacks of loosely/tightly couple differential pairs, differential impedance, advantages and disadvantages of edge (side by side), broadside (dual), asymmetric, and microstrip differentials; reflections and crosstalk in differentials, matching electrical lengths.
- HIGH SPEED CLOCKING
Clock, skew and jitter, the effects of ISI, skin, and dielectric losses; the effect of various base materials of long-haul transmission, a real-world example of compensation techniques.
- APERTURES, WAVE LENGTHS, ABSORPTION MATERIALS AND HEAT SINKING
The major concern today is the aperture openings versus the frequency of signals versus the higher density packaging, i.e. ICs are running hotter and the ever increasing signal edge rate. This leads to more radiation through the apertures, i.e. lamda is shorter, but more heat is generated because Power = C times F times V2. What’s new in enclosure absorption materials and what are their capabilities for minimizing radiation? What’s new in heat sink materials (backplanes, blades, servers) which in turn alleviate the need for heat conduction through the apertures? These current issues will also be covered in the course.
REGISTRATION: There is no obligation or payment required to enter the Registration for an actively scheduled course. We understand that you may need approvals but please register as early as possible or contact us so we know of your interest in this course offering.
SCHEDULING: If this course is not on the current schedule of open enrollment courses and you are interested in attending this or another course as an open enrollment, please contact us at (410)956-8805 or email@example.com. Please indicate the course name, number of students who wish to participate. and a preferred time frame. ATI typically schedules open enrollment courses with a 3-5 month lead-time. To express your interest in an open enrollment course not on our current schedule, please email us at firstname.lastname@example.org.
Robert Hanson, MSEE has unmatched experience in teaching and knowledge of electronics. As a Testability Overseer for Boeing Commercial Airline products, Mr. Hanson has worked with non-EEs and EE’s. His over 40 years of work experience in the design manufacturing and testing areas have enabled him to consult and train both nationally and internationally. As a digital design engineer at The Boeing Company, Rockwell, Honeywell, and Loral, Mr. Hanson designed and provided prototype operational analysis on many high-speed designs, including PCBs for AWACs, B1-B, 747-400, missiles, and ground support test equipment. He has played a very active role in automating the line, implementing robotics and participating in produciblity studies, and working in the CAE/Cad/CAT, JIT , simulation and automatic assembly environments. He also has performed studies and headed research projects in the computer-integrated manufacturing environment. Mr. Hanson has extensive experience in the testing disciplines (both factory and field, commercial and military). His teaching experience include electronic conventions, over 100 private companies on site, and universities. Boeing Company awarded him Aerospace Man of the Year for saving $6,000,000 for inventing a new testing technique for the Boeing B-1 bomber electronics.