Grounding and shielding are two of the most effective techniques for combating EMI. This three-day course is designed for engineers, technicians, and operators, who need an understanding of all facets of grounding and shielding at the circuit, PCB, box, equipment and/or system levels. The course offers a discussion of the trade-offs for EMI control through grounding and shielding at all levels. Hardware demonstrations of the effect of various compromises and resulting grounding and shielding effectiveness are provided. The compromises that are demonstrated include aperture and seam leakage, and conductor penetrating the enclosure. The hardware demonstrations also include incorporating various "fixes" and illustrating their impact. Each attendee will receive a copy of Bill Duff’s new text,
Dr. William G. Duff (Bill) received a BEE degree from George Washington University, a MSEE degree from Syracuse University, and a DScEE degree from Clayton University. Bill is President of SEMTAS.
He is internationally recognized as a leader in the development of engineering technology for achieving EMC in communication and electronic systems. He has more than 40 years of experience in EMI/EMC analysis, design, test and problem solving for a wide variety of communication and electronic systems. He has extensive experience in applying EMI mitigation techniques to "fix" EMI problems at the circuit, equipment and system levels.
Bill is a past president of the IEEE EMC Society and a past Director of IEEE Division IV, Electromagnetics and Radiation. He served a number of terms on the EMC Society Board of Directors. Bill has received a number of IEEE awards including the Lawrence G. Cumming Award for Outstanding Service, the Richard R. Stoddard Award for Outstanding Performance and a "Best Paper" award. He was elected to the grade of IEEE Fellow in 1981 and to the EMC Hall of Fame in 2010. Bill has written more than 40 technical papers and 5 books on EMC. He also regularly teaches seminar courses on EMC. He is a NARTE Certified EMC Engineer.
Trade-offs Between Shielding, Cost, Size, Weight,etc.
Course Outline:
Introduction. A Discussion Of EMI Scenarios, Definition Of Terms, Time To Frequency Conversion, Narrowband-Vs-Broadband, System Sensitivities.
Potential EMI Threats (Ambient). An Overview Of Typical EMI Levels. A Discussion Of Power Line Disturbances And A Discussion Of Transients, Including ESD, Lightning And EMP.
Victim Sensitivities And Behavior. A Discussion Of Victim Sensitivities Including Amplifier Rejection, Out-Of-Band Response, Audio Rectification, Logic Family Susceptibilities And Interference- To-Noise Versus Signal-To-Noise Ratios.
Safety Earthing/Grounding Versus Noise Coupling. An Overview Of Grounding Myths, Hard Facts And Conflicts. A Discussion Of Electrical Shock Avoidance (UL, IEC Requirements), Lightning Protection And Lightning Rods And Earthing.
Ground Common Impedance Coupling (GCM). A Discussion Of Practical Solutions, From PCB To Room Level. An Overview Of Impedance Of Conductors (Round, Flat, Planes), Class Examples, GCM Reduction On Single Layer Cards, Impedance Reduction, DC Bus Decoupling And Multilayer Boards.
GLC Reduction Methods. A Discussion Of Floating And Single-Point Grounds, Balanced Drivers And Receivers, RF Blocking Chokes, Signal Transformers And Baluns, Ferrites, Feed-Through Capacitors And Opto-Electronics.
Cable Shields, Balanced Pairs And Coax. A Discussion Of Cable Shields And Compromising Practices, Shielding Effectiveness, Field Coupling, Interactions Of Ground Loops With Balanced Pair Shields, Comprehensive Grounding Rules For Cable Shields, Flat Cables And Connector And Pigtail Contributions To Shielding Effectiveness.
Cable-To-Cable Coupling (Xtalk). A Discussion Of The Basic Model, Capacitive And Magnetic Couplings, A Class Example And How To Reduce Xtalk.
Understanding Shielding Theory. An Overview Of Near-Field E And H, Far-Field, How A Metal Barrier Performs And Reflection And Absorption.
Shielding Effectiveness (SE) Of Barriers. A Discussion Of Performance Of Typical Metals, Low-Frequency Magnetic Shields, Conductive Coatings/Metallized Plastics And Aircraft Composites (CFC).
Box Shielding - Leakage Reduction. Calculation Of Apertures SE, Combination Of Multiple Leakages, SE Of Screen Mesh, Conductive Glass, Honeycombs, Component Penetrations (Fuses, Switches, Etc.), And EMI Gaskets.
Tuition:
Tuition for this three-day course is $1795 per person at one of our scheduled public courses. Onsite pricing is available. Please call us at410-956-8805 or send an email to ati@aticourses.com.
Dr. William G. Duff (Bill) received a BEE degree from George Washington University, a MSEE degree from Syracuse University, and a DScEE degree from Clayton University. Bill is President of SEMTAS. 
